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MC100LVELT23 3.3 V Dual Differential LVPECL/LVDS to LVTTL Translator
Description
The MC100LVELT23 is a dual differential LVPECL/LVDS to LVTTL translator. Because LVPECL (Positive ECL) or LVDS levels are used only +3.3 V and ground are required. The small outline 8-lead package and the dual gate design of the LVELT23 makes it ideal for applications which require the translation of a clock and a data signal. The LVELT23 is available in only the ECL 100K standard. Since there are no LVPECL outputs or an external VBB reference, the LVELT23 does not require both ECL standard versions. The LVPECL inputs are differential. Therefore, the MC100LVELT23 can accept any standard differential LVPECL input referenced from a VCC of +3.3 V.
Features
http://onsemi.com MARKING DIAGRAMS*
8 1 SOIC-8 D SUFFIX CASE 751 8 1 TSSOP-8 DT SUFFIX CASE 948R 8 KVT23 ALYW G 1
8 KR23 ALYWG G
* * * * * * * *
2.0 ns Typical Propagation Delay Maximum Frequency > 180 MHz Differential LVPECL Inputs PECL Mode Operating Range:VCC = 3.0 V to 3.8 V with GND = 0 V 24 mA LVTTL Outputs Flow Through Pinouts Internal Pulldown and Pullup Resistors Pb-Free Packages are Available
1
1 DFN8 MN SUFFIX CASE 506AA
A L Y W M G
= Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package
(Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
December, 2006 - Rev. 14
1
Publication Order Number: MC100LVELT23/D
4J M G G 4
MC100LVELT23
Table 1. PIN DESCRIPTION
D0 1 8 VCC Pin Q0, Q1 D0*, D1* D0*, D1* VCC GND EP Function LVTTL Outputs Differential LVPECL Inputs Positive Supply Ground Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open.
D0
2 LVPECL LVTTL
7
Q0
D1
3
6
Q1
** Pins will default to VCC/2 when left open. D1 4 5 GND
Figure 1. 8-Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES
Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model CDM Value 50 kW 50 kW > 1500 V > 100 V > 2000 V Level 1 UL 94 V-0 @ 0.125 in 91
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. Refer to Application Note AND8003/D for additional information. Oxygen Index: 28 to 34
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MC100LVELT23
Table 3. MAXIMUM RATINGS
Symbol VCC VI Iout TA Tstg qJA qJC qJA qJC qJA Tsol Parameter PECL Power Supply Input Voltage Output Current Operating Temperature Range Storage Temperature Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm <2 to 3 sec @ 248C <2 to 3 sec @ 260C SOIC-8 SOIC-8 SOIC-8 TSSOP-8 TSSOP-8 TSSOP-8 DFN8 DFN8 Condition 1 GND = 0 V GND = 0 V, VI not more positive than VCC Continuous Surge Condition 2 Rating 3.8 3.8 50 100 -40 to +85 -65 to +150 190 130 41 to 44 5% 185 140 41 to 44 5% 129 84 265 265 Unit V V mA C C C/W C/W C/W C/W C/W C/W C/W C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 4. LVPECL INPUT DC CHARACTERISTICS VCC = 3.3 V; GND = 0 V (Note 2)
-40C Symbol ICCH ICCL VIH VIL VIHCMR IIH IIL Characteristic Power Supply Current (Outputs set to HIGH) Power Supply Current (Outputs set to LOW) Input HIGH Voltage (Note 4) Input LOW Voltage (Note 4) Input HIGH Voltage Common Mode Range (Notes 3 and 4) Input HIGH Current Input LOW Current D -150 Min 10 15 2135 1490 1.2 Typ 18 26 Max 25 36 2420 1825 VCC 150 -150 Min 10 15 2135 1490 1.2 25C Typ 18 26 Max 25 36 2420 1825 VCC 150 -150 Min 10 15 2135 1490 1.2 85C Typ 18 26 Max 25 36 2420 1825 VCC 150 Unit mA mA mV mV V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. All values vary 1:1 with VCC. VCC can vary 0.3 V. 3. VIHCMR min varies 1:1 with GND, max varies 1:1 with VCC. 4. LVTTL output RL = 500 W to GND.
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MC100LVELT23
Table 5. LVTTL OUTPUT DC CHARACTERISTICS VCC = 3.3 V; GND = 0V (Note 5)
-40C Symbol VOH VOL IOS Characteristic Output HIGH Voltage (IOH = -3.0 mA) (Note 6) Output LOW Voltage (IOL = 24 mA) (Note 6) Output Short Circuit Current -180 Min 2.4 0.5 -50 -180 Typ Max Min 2.4 0.5 -50 -180 25C Typ Max Min 2.4 0.5 -50 85C Typ Max Unit V V mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. All values vary 1:1 with VCC. VCC can vary 0.3 V. 6. LVTTL output RL = 500 W to GND.
Table 6. AC CHARACTERISTICS VCC = 3.3 V; GND = 0 V (Notes 7, 8)
-40C Symbol Fmax tPLH, tPHL tSK+ + tSK- - tSKPP tJITTER VPP tr tf Characteristic Maximum Toggle Frequency (Note 9) Propagation Delay to Output Differential Output-to-Output Skew++ Output-to-Output Skew- - Part-to-Part Skew (Note 10) Random Clock Jitter (RMS) Input Voltage Swing (Differential Configuration) (Note 11) Output Rise/Fall Times (0.8 V - 2.0 V) Q, Q 200 330 Min 180 1.0 1.5 15 35 70 4.0 800 600 2.5 60 80 500 10 1000 900 200 330 Typ Max Min 180 1.0 1.7 15 40 70 4.0 800 600 2.5 70 80 500 10 1000 900 200 330 25C Typ Max Min 180 1.0 1.7 30 40 140 4.0 800 650 2.5 125 80 500 10 1000 900 85C Typ Max Unit MHz ns ps
ps mV ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. All values vary 1:1 with VCC. VCC can vary 0.3 V. 8. LVTTL output RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2. 9. Fmax guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only. 10. Skews are measured between outputs under identical conditions. 11. 200 mV input guarantees full logic swing at the output.
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes fixture capacitance
CL *
RL
AC TEST LOAD
Figure 2. TTL Output Loading Used for Device Evaluation http://onsemi.com
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GND
MC100LVELT23
ORDERING INFORMATION
Device MC100LVELT23D MC100LVELT23DG MC100LVELT23DR2 MC100LVELT23DR2G MC100LVELT23DT MC100LVELT23DTG MC100LVELT23DTR2 MC100LVELT23DTRG MC100LVELT23MNR4 MC100LVELT23MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
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MC100LVELT23
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AH
-X-
A
8 5
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC100LVELT23
PACKAGE DIMENSIONS
TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A
8x
K REF 0.10 (0.004)
M
0.15 (0.006) T U
S 2X
TU
S
V
S
L/2
8 1
5
L
PIN 1 IDENT
4
B -U-
0.25 (0.010) M
0.15 (0.006) T U
S
A -V-
F DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_
C 0.10 (0.004) -T- SEATING
PLANE
D
G DETAIL E
-W-
DIM A B C D F G K L M
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MC100LVELT23
PACKAGE DIMENSIONS
DFN8 CASE 506AA-01 ISSUE D
D A B
PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35
E
2X
0.10 C
2X
0.10 C
0.10 C
8X
0.08 C
SEATING PLANE
A1
8X
L
K
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
CCCC CCCC CCCC CCCC
D2 e/2
1 8
TOP VIEW
A (A3) C e
4
SIDE VIEW
E2
5 8X
b
0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
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MC100LVELT23/D

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